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Waffle Pack Chip Trays made from anti static materials to ensure safe handling and storage of delicate semiconductor IC chips

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Waffle Pack Chip Trays made from anti static materials to ensure safe handling and storage of delicate semiconductor IC chips

Model Number : HN25007

Mold Type : Injection

Capacity : 5x10=50 PCS

MOQ : 500 pcs

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Payment Terms : T/T

Color : Black

Cavity Size : 6.7X3.1X0.5 mm

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Outline Line Size : 50.7×50.7×4 mm

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Brand Name : Hiner-pack

Reusable : Yes

Packing Level : Transport package

Warpage : Warpage MAX 0.22mm

Tray Shape : Rectangular

Certification : ROHS, ISO

Ic Type : BGA,QFP,QFN,LGA,PGA

Place of Origin : China

Clean Class : General And Ultrasonic Cleaning

Packaging Details : CARTON, PALLET

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Anti-Static Waffle Trays for Secure Storage of Delicate Semiconductor IC Chips
Equipped with independent recessed pockets to hold electronic components separately. Cut down shifting, friction and surface damage throughout testing, handling and storage processes.

Maintain stable conductive properties to eliminate static threats. Adapt to continuous repeated operation inside electronics manufacturing environments.

Allow adjustments to pocket dimensions and overall outlines. Deliver targeted storage solutions to match different production and logistics requirements from electronics industries.
Key Features/ Benefits
  • Stable conductive ESD performance
  • Independent separated pockets
  • Durable construction
  • Secure chip holding
  • Support custom specifications
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25007
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4 mm
Cavity Size 6.7X3.1X0.5 mm
Matrix QTY 5x10=50 PCS
Warpage MAX 0.22mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Ideal for storing and transporting semiconductor devices and electronic components. Separate pocket design effectively avoids collision and electrostatic damage.
Suitable for semiconductor factories, electronics assembly plants and component distributors for testing, production transfer and inventory management.
Customized Services
Customization service is available to satisfy varied industrial requirements. Pocket dimensions and overall sizes can be developed as requests. Professional technical team supports project cooperation. Reach out to discuss tailored solutions for your production lines.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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