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Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

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Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

Model Number : HN24198

Mold Type : Injection

Capacity : 16x16=256 PCS

Payment Terms : T/T

Color : Black

Cavity Size : 1.8x1.8x1.27 mm

Price : $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）

Quality Assurance : Delivery Guarantee, Reliable Quality

Supply Ability : 2000PCS/Day

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Outline Line Size : 50.7×50.7×4 mm

MOQ : 500 pcs

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Packaging Details : CARTON, PALLET

Ic Type : BGA,QFP,QFN,LGA,PGA

Place of Origin : China

Clean Class : General And Ultrasonic Cleaning

Tray Shape : Rectangular

Brand Name : Hiner-pack

Reusable : Yes

Packing Level : Transport package

Warpage : Warpage MAX 0.26mm

Certification : ROHS, ISO

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Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs
Deliver precise grid-style waffle structure to securely hold fine pitch ICs, preventing component shifting and electrostatic damage during handling. Made of durable anti-static material to maintain stable performance in industrial settings, offering reliable protection for sensitive semiconductor devices.

Integrate smoothly with automated pick-and-place systems and clean manufacturing workflows, performing reliably in chip loading, transfer, and sorting procedures. Adapt flexibly to high-precision semiconductor production scenarios, boosting operational efficiency and component integrity.

Support full customization of cavity size, pitch, and layout to match unique fine pitch IC dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard delicate components throughout transit and long-term storage.
Key Features/ Benefits
  • Durable anti-static material
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24198
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4 mm
Cavity Size 1.8x1.8x1.27 mm
Matrix QTY 16x16=256 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Support advanced semiconductor packaging, fine pitch die sorting, device testing, and precision component kitting operations. Pair seamlessly with automated pick-and-place systems, ESD-controlled production lines, and clean manufacturing environments.

Also used for inter-plant component transfer, international shipping of sensitive fine pitch devices, and long-term inventory storage. Serve semiconductor fabs, advanced packaging facilities, and high-tech electronic component distributors.
Packaging & Shipping/ Services
Come in standard anti-static packaging to ensure product integrity during transit. Each tray is wrapped in protective film and placed in rigid cartons to prevent deformation and scratches.

Support bulk shipping via sea, air or express, with secure stacking to avoid damage during long-distance transportation. Ensure products arrive in good condition for immediate use in production.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

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