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Waffle Box Anti-Static Bare Die Trays With Chip Scale Packages

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Waffle Box Anti-Static Bare Die Trays With Chip Scale Packages

Brand Name : Hiner-pack

Model Number : HN24121

Certification : ISO 9001 ROHS SGS

MOQ : 1000 Pcs

Price : $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)

Packaging Details : It Depends On The QTY Of Order And Size Of Product

Delivery Time : 5~8 Working Days

Payment Terms : T/T

Supply Ability : 4000PCS~5000PCS/per Day

Place of Origin : SHENZHEN CN

Application : Transport, Storage, Packing Of Bare Die

Clean Class : General And Ultrasonic Cleaning

Warpage : <0.3mm

Property : ESD

Anti-Static : Yes

Injection Mold : Lead Time 20~25 Days

Surface Resistance : 1.0x10E4~1.0x10E11Ω

Design : Original Sample Or We Can Create The Designs

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Product Description:

Bare Die Trays are highly sought-after due to their compact size. They are particularly favored for small die, Chip Scale Packages (CSP), and components of similar sizes where a full-size JEDEC matrix tray would be too big. Despite their smaller footprint, bare die trays provide industry-standard acceptance and effective protection for components.

The stacked design of bare die trays creates protective compartments for parts, making them convenient for packaging and transportation.

Bare die trays are notably popular for manual loading and unloading tasks, with commercial feeders also available. Additionally, we offer custom JEDEC matrix trays that function as adaptors for processing bare die trays in JEDEC tray feeders and handlers.

Features:

  • Trays are made of top-quality materials such as conductive plastics and non-conductive polymers, which prevent ESD damage while ensuring durability. This safeguards the bare dies from common ESD hazards in the semiconductor industry. Each mold is custom-made to specific dimensions for different bare die sizes.
  • The tray's pocket helps to shape it for a snug fit, creating a secure environment with no movement or potential damage during use.
  • Die trays are offered in a wide range of sizes, accommodating small microchip dimensions to large integrated circuits. Tailored tray designs cater to diverse industry needs and innovative requirements.
  • Protective casings are crucial for semiconductor manufacturing and assembly processes, providing protection for individual bare dies during transport or storage. They are stackable to optimize space efficiency, allowing for easy storage by stacking the trays securely.

Technical Parameters:

HN24121 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
PC Black 11*13=143PCS 5.95*4.7*1.3mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable;Reusable;Rcofriendly;Biodegradable
Sample A. The free samples: Choosen from existing products.
B. Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D
Waffle Box Anti-Static Bare Die Trays With Chip Scale Packages

Customization:

When compared to standard bare die trays commonly available in catalogs or from distributors, we specialize in crafting custom bare die trays tailored to the exact dimensions of your parts. These trays are molded from materials selected to meet your specific requirements and can feature custom options including component support features, temperature rating, color choice, engraving, reference marks, fiducials, special sizes, or thickness.

Waffle Box Anti-Static Bare Die Trays With Chip Scale Packages

Product Tags:

Waffle Box Bare Die Trays

      

Chip Scale Packages Bare Die Trays

      

Anti-Static Bare Die Trays

      
Quality Waffle Box Anti-Static Bare Die Trays With Chip Scale Packages wholesale

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